Packaging Design and SI/PI Engineer

Location:

(R1111) Romania

Salary:

market rate

Type:

Permanent

Main Industry:

Search Information Technology Jobs

Advertiser:

microTECH Global Ltd

Job ID:

132905212

Posted On:

21 April 2026

Packaging Design and SI/PI Engineer

Romania – Onsite working required

We are seeking a mid-to-senior level Packaging Design & Signal/Power Integrity (SI/PI) Engineer with an Electrical Engineering or related degree. You will help define and deliver advanced micro-electronic packaging solutions for a complex, high-performance system, working closely with silicon, photonics, and systems teams.

What you’ll do

-Own design and layout of advanced micro-electronic packages
-Define electrical and physical requirements with cross-functional engineering teams
-Run SI/PI simulations to optimize package and system performance
-Collaborate with vendors to ensure manufacturability and cost targets
-Track project progress and communicate updates weekly
-Produce technical reports and present results to stakeholders
-Maintain and improve EDA tools and design workflows
Required qualifications

-Bachelor’s degree in Electrical Engineering or related field + 5 years’ experience
-Experience in substrate design and advanced packaging
-Strong SI/PI simulation and analysis skills
-Proficiency with tools such as SIwave, HFSS, APD or equivalent
-Strong communication skills and ability to work across global teams
-Ability to handle confidential technical information
Preferred qualifications

-Master’s degree or higher
-Experience with packaging processes (flip-chip, wire bonding, die attach, etc.)
-Familiarity with tools like Altium, Allegro, Spectre, HSPICE, Sigrity, ADS
-Data analysis experience (JMP or Excel)
-Programming skills in Python or C++
-Experience testing electronic packages or systems

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