Senior SI/PI Engineer – Bucharest

Location:

(R1111) Romania

Salary:

market rate

Type:

Permanent

Main Industry:

Search Engineering Jobs

Advertiser:

microTECH Global Ltd

Job ID:

132936097

Posted On:

29 April 2026

We are seeking Senior Level PCB Signal/Power Integrity Engineer with degree in Electrical Engineering, or a related field.

What you’ll do

-Own and execute high-speed Signal Integrity (SI) and Power Distribution Network (PDN) simulations and validation.
-Collaborate with multi-disciplinary engineers (EE, System and Package) to define electrical performance related to SI, PI, EMI and EMC
-Develop engineering test plans and methodologies for SI and PI simulation, including modelling of power networks, parasitic, impedance-controlled transmission lines, vias, connectors, sockets, and system components.
-Validate power and signal integrity in laboratory settings, ensuring alignment with design specifications and simulation outcomes.
-Analyze simulation and lab data to identify design issues and propose corrective actions.
-Ability to support multiple projects concurrently, ensuring timely completion of design and validation tasks.

Required Qualifications

-Minimal requirement is a bachelor’s degree with 8 years of experience
-Proficiency with Ansys SIwave, Ansys HFSS, Altium 365, Cadence Sigrity, and Keysight ADS.
-Experience design in of complex SoCs, PMICs, mixed-signal analog/digital designs for sensors and high-speed interfaces such as LPDDR4/4x, MIPI, 10G Ethernet and PCIe Gen 2/3
-Experience with system-level timing, loss budget including silicon, package and board impairments
-Experience with lab measurements, debugging, and SI correlations using oscilloscopes, spectrum analyzer, VNA and TDR
-Fluent in English communication, able to collaborate with teammates in different time zones
-Ability to travel internationally as needed
-Maintain company confidential information are a must

Preferred Qualifications

-Master’s degree with more experience is highly desired
-Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
-Nice to have experience in substrate design and packaging technology
-Familiar with some of the device packaging processes such as die attach, flip chip, and wire bonding.
-Data analysis experience such as JMPs is a plus; Excel is OK.
-Programming and software maintenance skills are desired e.g. python, or C++

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