Package Design Engineer – Leuven

Location:

(B-3001) Belgium

Salary:

market rate

Type:

Contract

Start Date:

asap

Contract Period:

6 months

Main Industry:

Search Electronics Jobs

Advertiser:

microTECH Global Ltd

Job ID:

132804668

Posted On:

27 March 2026

Job Title: Package Design Engineer (12-Month Contract)
Location: Leuven, Belgium (3 days on-site, 2 days remote)
Contract Length: 12 Months
Start Date: 01/04/2026

Overview

We are seeking a skilled Package Design Engineer for a 12-month temporary assignment. The successful candidate will perform IC package design and analysis, including signal integrity (SI) and power integrity (PI) simulations, and collaborate closely with customers and suppliers.

This role offers a blend of hands-on technical work and cross-functional collaboration, ideal for engineers experienced in advanced IC packaging.
Key Responsibilities

-Select and design the appropriate IC package type based on given specifications and IC requirements.
-Perform a comprehensive analysis of the package’s electrical characteristics and identify potential design limitations.
-Optimize electrical performance focusing on signal integrity, power integrity, and electromagnetic compatibility (EMC).
-Analyze routing, parasitic effects, and noise issues associated with the package and propose design modifications or enhancements.
-Consider manufacturability and cost optimization, ensuring compatibility with manufacturing processes, assembly requirements, and materials availability.
-Produce detailed reports summarizing analysis, design modifications, and optimization recommendations, including diagrams, simulations, calculations, and experimental results.
-Communicate effectively with internal teams, customers, and suppliers regarding design decisions and performance impacts.Required Knowledge & Skills

-MSc in Electronics or equivalent, with at least 5 years’ experience in IC packaging design and SI/PI analysis
-Strong knowledge of Cadence layout tools
-Experience with Ansys simulation tools
-Familiarity with 2.5D/3D packaging and backend silicon layout (place & route)
-Excellent communication skills in EnglishWhat We Offer

-Exciting temporary assignment in a collaborative, high-tech environment
-Opportunity to work on cutting-edge IC packaging projects
-Duration: 12 months, with potential extension
-Work regime: Full-time, hybrid (3 days on-site in Leuven, 2 days remote)

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