microTECH Global Ltd
- Location:
- (Paris) France
- Salary:
- market rate
- Type:
- Permanent
- Main Industry:
- Search Engineering Jobs
- Advertiser:
- microTECH Global Ltd
- Job ID:
- 130364969
- Posted On:
- 18 April 2024
IC Package Tech Lead
France – Hybrid working
High competitive salary plus employee benefits
Job Description:
•Drive, in close collaboration with the assembly centers (in Europe and Asia) and with our design/R&D team, the specifications of the package of the ICs
•Participate with our IC design team to the definition and/or design of reliable Ball Grid Array package substrates, using specific electrical CAD tools
•Prepare the relevant documentation for BGA substrate design approval and substrate first procurement in accordance.
•Drive advanced package material selection through standard and innovative solutions to meet the total product package performance requirements across the product application domains
•Perform feasibility studies for early assessment of substrate technology and electrical performances
•Cooperate with assembly center R&D teams for continuous design performance improvement
•Drive and/or execute Mechanical, Thermal and Electrical Modeling in cooperation with the assembly partners
•Contribute to the integration of solutions in customers application on packaging related aspects and thermal dissipation system implementation
To be considered you will need the following:
•You have a MSc in Electrical Engineering or equivalent and 5+ years of hands-on experience in IC package definition, selection, and qualification.
•You have good knowledge of IC package assembly development process
•You have experience in high performance Flip-Chip BGA packaging type for large size, high-speed and high-power IC.
•You have experience in determining impact of packaging on PCB design, board and system integration including high speed digital and RF aspects
•You have experience in system level thermal dissipation technologies (through board, heat spreader, heat sink, fan…). Experience in thermal simulation is a plus.
•Team spirit, curiosity, flexibility, sense of commitment, high quality standards
•Good analytical and problem-solving skills
•Proven customer contact skills
•Fluent in English; French is a plus
•Experience in die-to-die interconnect Technologies is a plus.
•RF experience is a plus
•Knowhow on interconnection design tools is a plus
Please get in touch with Christina McGuire to hear more about this incredible position!
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