Camera Module (Hardware) Consultant – Finland (Contract)

Location:

(00180) Finland

Salary:

market rate

Type:

Permanent

Main Industry:

Search Engineering Jobs

Advertiser:

microTECH Global Ltd

Job ID:

133324498

Posted On:

24 August 2026

You’ll be an integral member of our Camera Module Hardware team, working hands-on across the full development cycle — from early schematic capture through bring-up, characterization, and evaluation reporting — and we’re looking for an engineer passionate about delivering novel, high-quality hardware for millions of users.

Job Descriptions:

-Designing, prototyping, and testing camera module assemblies for next-generation smartphones

-Capturing schematics and owning PCB layout and routing for evaluation boards and prototypes

-Getting hands-on in the lab: soldering, wiring, probing, and measuring — you’ll know your way around a bench

-Bringing up image sensors, actuators, and power management circuits from scratch

-Configuring image sensors and actuators at the firmware level, including still image and video streaming pipelines

-Running a full suite of electrical measurements — analog and digital — to validate designs and chase down root causes

-Performing simulations across electrical, electromagnetic, EMI, and signal integrity domains

-Translating findings into clear, rigorous evaluation reports for engineering peers and executive stakeholders

Qualifications and detailed requirements:

-MSc or PhD degree in electrical engineering or other relevant fields

-Hands-on experience in electronics hardware engineering, ideally in consumer electronics or mobile

-Solid grounding in PCB design — schematic capture, layout, and routing — with a practical understanding of signal integrity and EMI considerations

-Comfortable at the bench: you solder, probe, and measure without hesitation

-Experience bringing up mixed-signal systems, including image sensors, VCMs, or power management ICs

-Some exposure to firmware-level device control (I²C, SPI, MIPI CSI-2, or similar)

-Strong written communication — you can write a teardown report that’s effective both at engineering and executive levels

-Fluent in English, both written and spoken

-Big advantage for contestants from international competitions in computer science, mathematics, or physics (e.g. IOI, IMO, ICPC, IPhO, IChO)

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